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| 1. general description the TFA9892 is a high efficiency class-d aud io amplifier with a s ophisticated speaker boost and protection algorithm. it can deliver 13.2 w peak output power into an 8 ? speaker at a supply voltage of 4.0 v. the internal boost converter raises the supply voltage to 12 v, providing ample headroom for major improvements in sound quality. a safe working environment is provided for the speaker under all operating conditions. the TFA9892 maximizes acoustic output while ensuring diaphragm displacement and voice coil temperature do not exceed their ra ted limits. this function is based on a speaker box model that operates in all loudspeaker environments (e.g. free air, closed box or vented box). furthermore, advanced signa l processing ensures the quality of the audio signal is never degraded by unwanted clipping or distortion in the amplifier or speaker. an integrated multiband dynamic range compressor (mdrc) allows the speaker to operate at the highest possible power rating without suffering physical damage. unlike competing solutions, the adaptive sound maximizer algorithm uses feedback to accurately calculate both the temperature and the excursion, allowing the TFA9892 to adapt to changes in the acoustic environment. internal intelligent dc- to-dc conversion boosts the supp ly rail to provide additional headroom and power output. the supply voltage is only raised when necessary. this maximizes the output power of the class-d au dio amplifier while lim iting quiescent power consumption in combination with a puls e frequency modulation (pfm) scheme. the device can be configured to drive either a hands-free speaker (4 ?? to 8 ? ) for audio playback, or a receiver speaker (32 ? ) for handset playback, allowing it to be embedded in platforms that support either or both options. the maximum output power, gain, and noise levels are lower in the handset call use case than in the hands-free call use case. the TFA9892 also incorporates advanced battery protection. by limiting the supply current when the battery voltage is low, it prevents the audio system from drawing excessive load currents from the battery, which could cause a system undervoltage. the advanced processor minimizes the impact of a falling battery voltage on the audio quality by preventing distortion as the battery discharges. because it has a digital input interface, the tfa98 92 features low rf susceptibility. the second order closed loop architecture used in a class-d audio amplifier provides excellent audio performance and high supply voltage ripple rejection. the tdm/i 2 s audio interface provides a wide range of settings for multiple slots and digital i/o. the settings are communicated via an i 2 c-bus interface. TFA9892 12 v boosted audio system wit h adaptive sound maximizer and speaker protection rev. 1.0 ? 1 september 2017 product short data sheet
TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 2 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection the device also provides the speaker with robust protection against esd damage. in a typical application, no additional component s are needed to withstand a 15 kv discharge on the speaker. the TFA9892 is available in a 49-bump wlcsp (wafer level chip-size package) with a 400 ? m pitch. 2. features and benefits ? output power: 6.6 w into 8 ? at 4.0 v supply voltage (thd = 1 %) ? wide range of speakers: 4 ?? to 8 ?? for hands-free mode and 16 ? , 32 ? for handset one ? sophisticated speaker-boost and protec tion algorithm that maximizes speaker performance while protecting the speaker: ? fully embedded software, no additional license fee or porting required ? total integrated solution that includes ds p, classd amplifier, dc-to-dc converter ? adaptive excursion control - guarantees t hat the speaker membrane excursion never exceeds its rated limit ? multiband dynamic range compressor (drc) allows independent control of up to three frequency bands ? real-time temperature protection - direct measurement ensures that voice coil temperature never exceeds its rated limit ? environmentally aware - automatically adap ts speaker parameters to acoustic and thermal changes including compensation for speaker-box leakage ? four tdm/i 2 s inputs output (i/o) to support two audio sources or one pdm input and inter-chip communications ? speaker current and voltage monitoring via tdm for acoustic echo cancellation (aec) at the host ? option to route tdm input direct to tdm ou tput to allow a seco nd tdm output slave device to be used in combination with the TFA9892 ? sample frequencies f s from 16 khz to 48 khz supported in tdm/i2s mode; speaker-boost and protection algorithm sample rate up to 48 khz. ? 3 bit clock/word select ratios suppor ted (32x, 48x, 64x) in tdm/i2s mode ? i 2 c-bus control interface (400 khz) ? 12 v dc-to-dc converter using pfm mode ? wide supply voltage range (fully operational from 2.7 v to 5.5 v) ? fully short-circuit proof across the load and to the supply lines ? low rf susceptibility ? input clock jitter in sensitive interface ? thermally protected ? 15 kv system-level esd protecti on without external components ? ?pop noise' free at all mode transitions 3. applications ? mobile phones ? ta b l e ts TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 3 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection ? portable navigation devices (pnd) ? notebooks/netbooks ? mp3 players and portable media players ? small audio systems 4. quick reference data 5. ordering information table 1. quick reference data symbol parameter conditions min typ max unit v bat battery supply voltage on pin vbat 2.7 - 5.5 v v ddd digital supply voltage on pin vddd 1.65 1.8 1.95 v i bat battery supply current on pin v bat and in dc-to-dc converter coil; operating modes with load; dc-to-dc converter in adaptive boost mode (no output signal, v bat =3.6v, v ddd =1.8v) -2.45-ma power-down mode - 1 5 ? a i ddd digital supply current on pin vddd; operating mode; no audio stream at the input; dsp enabled; speakerboost activated -20-ma operating mode; no audio content; dsp bypassed -4.5-ma on pin vddd; power-down mode no external clk or data provided -15- ? a on pin vddd; power-down mode; internal oscillator enabled; no external clk or data provided -50- ? a p o(av) average output power thd+n = 1 %; r l =8 ? ; v bat = 4.0 v - 6.6 - w table 2. ordering information type number package name description version TFA9892auk/n1 wlcsp49 wafer level chip-scale package; 49 bumps ; 3.13 ? 3.63 ? 0.5 mm sot1444-8 TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 4 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 6. block diagram fig 1. block diagram 7 ) $ d d d $ ' 6 ' & , 1 6 ( / 2 8 7 $ 2 8 7 % & / $ 6 6 ' $ 8 ' , 2 $ 0 3 / , ) , ( 5 9 3 : 0 5 $ 0 5 2 0 0 ( 0 2 5 < * 1 ' 3 7 ( 0 3 6 ( 1 6 ( 9 % $ 7 6 ( 1 6 ( 9 ' ' 3 6 ( 1 6 ( 7 ( 6 7 $ ' & * $ , 1 6 7 * $ , 1 & $ 5 ' ( & , 6 ( / ' ( & y v ' ( & f v & $ 5 ' ( & , 6 ( / ' ( & v w 7 ( 6 7 7 ( 6 7 7 ( 6 7 * 1 ' ' , 1 % $ ' $ 3 7 , 9 ( ' & w r ' & & 2 1 9 ( 5 7 ( 5 9 % 6 7 * 1 ' % 9 ' ' 3 7 ' 0 , 6 9 r o w d j h 6 h q v h & x u u h q w 6 h q v h ' , 2 6 ( / ' $ 7 $ 6 ( / ( & 7 2 5 s u r s u r 3 / / 2 6 & 9 ' ' ' $ ' 6 , 5 4 5 ( * , 6 7 ( 5 6 7 ( 6 7 7 ( 6 7 3 ' 0 2 3 ' 0 2 8 7 3 8 7 3 ' 0 , 1 3 8 7 9 % $ 7 0 8 ; 0 8 ; ) 6 ' , 2 ' , 2 ' , 2 % & . ) 6 6 ' $ 6 & / 5 6 7 , 1 7 % & . 3 ' 0 & / ' , 2 6 3 ' 0 , o r r s e d f n g f g f h [ w * d l q 2 v l v l v l v r v r v r v r v r v r v r ' 6 3 2 $ ( & o r r s e d f n * d l q , q / 5 * $ , 1 , 1 7 7 ' 0 6 3 . * $ 0 3 , 1 6 ( / 0 8 ; 0 8 ; 0 8 ; 6 3 ( $ . ( 5 3 5 2 7 ( & 7 , 2 1 0 8 ; , & 3 5 2 7 ( & 7 , 2 1 2 7 3 8 9 3 2 & 3 , ' 3 TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 5 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 7. pinning information 7.1 pinning a. bottom view b. transparent top view fig 2. bump configuration * ) & % $ d d d e x p s $ l q g h [ d u h d ( ' $ % e x p s $ l q g h [ d u h d & ' ( d d d ) * TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 6 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection transparent top view fig 3. bump mapping d d d % & . 3 ' 0 & / . ) 6 ' , 2 ' , 2 , 1 7 * 1 ' ' 2 8 7 % 9 ' ' 3 % & . * 1 ' ' ' , 2 5 6 7 * 1 ' 3 * 1 ' 3 9 ' ' 3 ' , 2 6 3 ' 0 , * 1 ' ' 7 ( 6 7 7 ( 6 7 * 1 ' ' 2 8 7 $ 9 ' ' 3 ) 6 * 1 ' ' 7 ( 6 7 7 ( 6 7 * 1 ' ' 2 8 7 $ 2 8 7 $ 6 ' $ $ ' 6 $ ' 6 * 1 ' ' * 1 ' % , 1 % 9 % 6 7 6 3 ' 0 2 7 ( 6 7 7 ( 6 7 * 1 ' % , 1 % 9 % 6 7 6 & / 9 % $ 7 $ % & ' ) ( * 9 ' ' ' * 1 ' ' * 1 ' % , 1 % 9 % 6 7 TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 7 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection table 3. pinning symbol pin type description fs1 a1 i digital audio frame sync for dio1 dio1 a2 i/o digital audio interface dio1 dio4 a3 i/o digital audio data in / out dio4 int a4 o interrupt output; open if unused gndd a5 p digital ground outb a6 o inverting output vddp a7 p power supply voltage bck1 b1 i digital audio bit clock dio1 gndd b2 p digital ground dio3 b3 i digital audio data in/out dio3 rst b4 i reset input gndp b5 p power ground gndp b6 p power ground vddp b7 p power supply voltage dio2/ spdmi c1 i/o digital audio data in/out dio2 / spdm data input gndd c2 p digital ground test3 c3 o test signal input 3; for test purposes only, connect to pcb ground test2 c4 o test signal input 2; for test purposes only, connect to pcb ground gndd c5 p digital ground outa c6 o non-inverting output vddp c7 p power supply voltage fs2 d1 i digital audio word select for dio2 gndd d2 p digital ground test4 d3 o test signal input 4; for test purposes only, connect to pcb ground test1 d4 o test signal input 1; for test purposes only, connect to pcb ground gndd d5 p digital ground outa d6 - non-inverting output [1] outa d7 - non-inverting output [1] bck2/ pdmclk e1 i digital audio bit clock dio2 or pdm clock input spdmo e2 o pdm output; output open if unused test5 e3 o test signal input 5; for test purposes only, connect to pcb ground test6 e4 o test signal input 6; for test purposes only, connect to pcb ground gndb e5 p boosted ground inb e6 p dc-to-dc boost converter input vbst e7 o boosted supply voltage output sda f1 i/o i 2 c-bus data input/output ads1 f2 i address select input 1 ads2 f3 i address select input 2 gndd f4 p digital ground TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 8 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection [1] is used to simplify routing to outa gndb f5 p boosted ground inb f6 p dc-to-dc boost converter input vbst f7 o boosted supply voltage output scl g1 i i 2 c-bus clock input vbat g2 p battery supply voltage sense input vddd g3 p digital supply voltage gndd g4 p digital ground gndb g5 p boosted ground inb g6 p dc-to-dc boost converter input vbst g7 o boosted supply voltage output table 3. pinning ?continued symbol pin type description TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 9 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 8. functional description the TFA9892 is a highly efficient mono bridge tied load (btl) class-d audio amplifier with a sophisticated speakerbo ost protection algorithm. figure 1 is a block diagram of the TFA9892. a speakerboost protection algorithm, running on a coolflux digital signal processor (dsp) core, maximizes the acoustical out put of the speaker while limiting membrane excursion and voice coil temperature to a safe level. the mechanical protection implemented guarantees that speaker membrane excursion never exceeds its rated limit, to an accuracy of 10 %. thermal protection guarantees that the voice coil temperature never exceeds its rated lim it, to an accuracy of ? 10 ? c. furthermore, advanced signal processing ensures the audio quality remains acceptable at all times. the protection algorithm implements an adapt ive loudspeaker model that is used to predict the extent of membrane excursion. the model is continuously updated to ensure that the protection scheme remains effect ive even when speaker parameter values change or the acoustic enclosure is modified. output sound pressure levels are boosted within given mechanical, thermal and quality limits. an optional bandwidth extension mode extends the low frequency response up to a predefined limit before maximizing the output le vel. this mode is suit able for listening to high quality music in quiet environments. the frequency response of the TFA9892 can be modified via ten fully programmable cascaded second-order biquad filters. the fi rst two biquads are processed with 48-bit double precision; biquads 3 to 10 are processed with 24-bit single precision. at low battery voltage levels, the gain is automatically reduced to limit battery current. the output volume can be controlled by the speakerb oost protection algorithm or by the host application (external). in the latter case, the boost featur es of the speakerboost protection algorithm must be disabled to avoid neutralizing external volume control. the speakerboost protection algorithm ou tput is converted into two pulse width modulated (pwm) signals which are then inje cted into the class-d audio amplifier. the 3-level pwm scheme supports filterless speaker drive. an adaptive dc-to-dc converter boosts the ba ttery supply voltage in line with the output of the speakerboost protection algorith m. it switches to follower mode (v bst =v bat ; no boost) when the audio output voltage is lower than the battery voltage. next to adaptive dc to dc a pfm mode is selected when the re quested output current is low. the adaptive boost and pfm mode ensures a high efficiency classhd amplifier. it contains four tdm/i2s input/output (dio) po rts. these ports can be selected as an input or an output on demand. i.e. dio1 and dio2 , can be selected as the audio input stream. dio3 is provided to support stereo applications, while dio4 can be used to provide stereo aec as well. dio1, dio3 and dio4 are clocked by fs1 and bck1, while dio2 is clocked by fs2 and bck2; see figure 1 ). dio 3, 4 can be as well configured to transmi t the dsp output signal, amplifier output current and voltage information, or amplifier gain information. the gain information can be used to facilitate communication between two devices in stereo applications. TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 10 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection a ?pass-through? option allows one of the dio1 , 2, 3 as input to be connected directly to the dio4 output. the pass-through option is pr ovided to allow an output slave device (e.g. a codec), connected in parallel with the TFA9892, to be routed directly to the audio host via dio4 output. TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 11 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 9. limiting values [1] using an nxp demo board with a 1 mm wire/pcb track length on pin inb, ac pulses up to 18 v and ? 9 v can be observed without causing any damage as these spikes only partly penetrate the device (which is protected by internal clamp circuits). 10. thermal characteristics table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v x voltage on pin x on pin vbat ? 0.3 +6 v on pins vbst, vddp ? 0.3 +12.4 v on pin inb, outa, outb ? 0.3 +13.4 [1] v on pin vddd ? 0.3 +2.5 v on scl, sda, dio1, dio2, dio3, dio4 ? 0.3 +2.5 v t j junction temperature ? 40 +150 ? c t stg storage temperature ? 55 +150 ? c t amb ambient temperature ? 40 +85 ? c v esd electrostatic discharge voltage according to human body model (hbm) ? 2+2 kv according to charge device model (cdm) ? 500 +500 v table 5. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient 4-layer application board 35 k/w TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 12 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 11. characteristics 11.1 dc characteristics table 6. dc characteristics all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 12 v, adaptive boost mode; l bst =1 ? h [1] ; r l =8 ? [1] ; l l =40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb =25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit v bat battery supply voltage on pin vbat 2.7 - 5.5 v i bat battery supply current on pin vbat and in dc-to-dc converter coil; operating modes with load; dc-to-dc converter in adaptive boost mode (no output signal, v bat =3.6 v; v ddd =1.8v) -2.45- ma power-down mode - 1 5 ? a v ddp power supply voltage on pin vddp 2.7 - 12.2 v v ddd digital supply voltage on pin vddd; brown out detector (bod) disabled. [3] 1.65 1.8 1.95 v i ddd digital supply current on pin vddd; operating mode; no audio stream at the input; dsp enabled; speakerboost activated -20- ma operating mode; no audio content; dsp bypassed -4.5- ma power-down mode - 15 - ? a power-down mode; internal oscillator enabled -50- ? a pins dio1,2,3,4, bck1, fs1, bc k2, fs2, ads1, ads2, scl, sda v ih high-level input voltage 0.7v ddd -v ddd v v il low-level input voltage - - 0.3v ddd v c in input capacitance [2] --3pf i li input leakage current 1.8 v on input pin - - 0.1 ? a pins dio1,2,3,4, spdmi, int, push-pull output stages v oh high-level output voltage i oh =4 ma - - v ddd ? 0.4 v v ol low-level output voltage i ol =4 ma - - 400 mv pins sda, open drain outputs, external 10 k ? resistor to v ddd v oh high-level output voltage i oh =4 ma - - v ddd ? 0.4 v v ol low-level output voltage i ol =4 ma - - 400 mv pins outa, outb r dson drain-source on-state resistance amplifier active, nmos + pmos v ddp =12v -600- m ? protection t act(th_prot) thermal protection activation temperature 130 - 150 ? c v uvp(vbat) undervoltage protection voltage on pin vbat 2.3 - 2.5 v TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 13 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection [1] l bst = boost converter inductance; r l = load resistance; l l = load inductance (speaker). [2] this parameter is not tested during production; the value is guaranteed by design and ch ecked during product validation. [3] if bod is enabled min vddd range goes to 1.7 v 11.2 ac characteristics i o(ocp) overcurrent protection output current 2-- a dc-to-dc converter v bst maximum voltage on pin vbst maximum boost voltage setting 11.8 12 12.2 v table 6. dc characteristics ?continued all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 12 v, adaptive boost mode; l bst =1 ? h [1] ; r l =8 ? [1] ; l l =40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb =25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit table 7. ac characteristics all parameters are guaranteed for v bat =3.6v; v ddd =1.8v; v ddp =v bst = 12 v, adaptive boost mode; l bst =1 ? h [1] ; r l =8 ? [1] ; l l =40 ? h [1] ; f i = 1 khz; f s =48khz; t amb =25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit amplifier output power p o(av) average output power hands-free speaker thd+n = 1 %; v bat =4v r l =8 ? ; v bst =12v 6.6 w r l =6 ? ; v bst =10v 6.6 w r l =4 ? ; v bst =8.5v 6.7 w hands-free speaker thd+n = 10 %; v bat =4v r l =8 ? ; v bst =12v 8 w handset speaker thd+n = 1 %; v bst =12v; v bat =4v 2w amplifier output; pins outa and outb ? v o(offset) ? output offset voltage absolute value - - 0.5 mv amplifier performance ? po output power efficiency p o(rms) = 2.5 w; including dc-to-dc converter; 100 hz audio signal [2] -80-% thd+n total harmonic distortion-plus-noise p o(rms) =100mw; r l =8 ? ; l l =44 ? h [1] --0.1% v n(o) output noise voltage a-weighted; no output signal; coolflux dsp bypassed; handset mode; bck clock jitter < 1 ns (pll locked on bck) -16- ? v dr dynamic range v o = 10 v (peak); a-weighted - 115 - db s/n signal-to-noise ratio v o = 10 v (peak); a-weighted - 100 - db psrr power supply rejection ratio v ripple = 200 mv (rms); f ripple =217hz - 75 - db f sw switching frequency directly coupled to the tdm fs input frequency 256 - 384 khz g (i2s-vo) i 2 s to v o gain coolflux dsp bypassed, measured at input level -12 dbfs; tdmspkg = 0 db -21-db v pop pop noise voltage at mode transition and gain change 2 mv TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 14 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection [1] l bst = boost converter inductor; r l = load resistance; l l = load inductance (speaker). [2] this parameter is not tested during production; the value is guaranteed by design and ch ecked during product validation. [3] the pilot tone is removed at the zero crossing after a soft mute, which takes on average 10 ms (20 ms max.) at a sample rate of 48 khz and 15 ms (30 ms max.) at a sample rate of 16 khz. [4] if a higher value is used, lpm should be disabled. r l load resistance 4 8 32 ? c l load capacitance - - 200 pf amplifier power-up, power-down and propagation delays t d(on) turn-on delay time pll locked on bck f s = 16 to 48 khz - - 2 ms pll locked on fs f s =48khz - - 6 ms t d(off) turn-off delay time - - 10 ? s t d(mute_off) mute off delay time - 1 - ms t d(soft_mute) soft mute delay time coolflux dsp enabled [3] -120-ms t pd propagation delay coolflux dsp bypassed f s = 48 khz - - 600 ? s speakerboost protection mode, t lookahead = 10 ms, f s = 48 khz --12ms current-sensing performance s/n signal-to-noise ratio i o = 1.2 a (peak); a-weighted - 75 - db ? i sense current sense mismatch i o = 0.5 a (peak) ? 3- +3% b bandwidth [2] -8-khz l l load inductance r l 32 ? 30 - - ? h c l load capacitance to ground [4] -200-pf table 7. ac characteristics ?continued all parameters are guaranteed for v bat =3.6v; v ddd =1.8v; v ddp =v bst = 12 v, adaptive boost mode; l bst =1 ? h [1] ; r l =8 ? [1] ; l l =40 ? h [1] ; f i = 1 khz; f s =48khz; t amb =25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 15 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 11.3 tdm/i 2 s timing characteristics [1] l bst = boost converter inductance; r l = load resistance; l l = load inductance. [2] the i 2 s bit clock input (bck) is used as a clock input for the dsp, as well as for th e amplifier and the dc-to-dc converter. note tha t both the bck and fs signals need to be present for the clock to operate correctly. [3] this parameter is not tested during production; the value is guaranteed by design and ch ecked during product validation. [4] when the pll is locked on bck, amplifier output noise can deteriorate when clock jitter > 1 ns. [5] the system is less sensitive to jitter when the pll is locked on fs. table 8. tdm i 2 s bus interface characteristics; see figure 4 all parameters are guaranteed for v bat = 3.6 v; v ddd = 1.8 v; v ddp =v bst = 12 v, adaptive boost mode; l bst =1 ? h [1] ; r l = 8 ? [1] ; l l = 40 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unle ss otherwise specified. symbol parameter conditions min typ max unit f s sampling frequency on pin fs [2] 16 - 48 khz f clk clock frequency on pin bck [2] 32f s - 512f s hz t su set-up time fs edge to bck high [3] 10 - - ns data edge to bck high 10 - - ns t h hold time bck high to fs edge [3] 10 - - ns bck high to data edge 10 - - ns t j external clock jitte r pll locked on bck [4] --2 ns pll locked on fs [5] - - 20 ns fig 4. tdm/i 2 s timing % & . ) 6 ' $ 7 $ w k w v x d d d TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 16 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 11.4 i 2 c timing characteristics [1] l bst = boost converter inductance; r l = load resistance; l l = load inductance. [2] c b is the total capacitance of one bus line in pf. t he maximum capacitive load for each bus line is 400 pf. [3] after this period, the first clock pulse is generated. [4] to be suppressed by the input filter. table 9. i 2 c-bus interface characteristics; see figure 5 all parameters are guaranteed for v bat =3.6v; v ddd =1.8v; v ddp =v bst = 12 v, adaptive boost mode; l bst =1 ? h [1] ; r l =8 ? [1] ; l l =40 ? h [1] ; f i = 1 khz; f s =48khz; t amb =25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit f scl scl clock frequency - - 400 khz t low low period of the scl clock 1.3 - - ? s t high high period of the scl clock 0.6 - - ? s t r rise time sda and scl signals [2] 20 + 0.1 c b -- ns t f fall time sda and scl signals [2] 20 + 0.1 c b -- ns t hd;sta hold time (repeated) start condition [3] 0.6 - - ? s t su;sta set-up time for a repeated start condition 0.6 - - ? s t su;sto set-up time for stop condition 0.6 - - ? s t buf bus free time between a stop and start condition 1.3 - - ? s t su;dat data set-up time 100 - - ns t hd;dat data hold time 0 - - ? s t sp pulse width of spikes that must be suppressed by the input filter [4] 0 - 50 ns c b capacitive load for each bus line - - 400 pf fig 5. i 2 c timing w % 8 ) w / 2 : w u w i w + ' 6 7 $ w 6 8 6 7 $ w + ' ' $ 7 w + , * + w 6 8 ' $ 7 w + ' 6 7 $ w 6 8 6 7 2 w 6 3 3 6 6 u 3 6 ' $ 6 & / d d d TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 17 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 12. application information 12.1 application diagrams fig 6. typical mono application o & o 6 6 ' $ & 7 5 / $ ( & $ 8 ' , 2 , 1 6 & / ' , 2 ) 6 % & . ' , 2 5 6 7 , 1 7 % $ 6 ( % $ 1 ' 3 5 2 & ( 6 6 2 5 7 ) $ d d d 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 * 1 ' ' * 1 ' 3 * 1 ' % $ ' 6 $ ' 6 7 ( 6 7 2 8 7 $ 2 8 7 % & 9 ' ' 3 [ ? ) & ( 0 & q ) 9 ' ' 3 9 % 6 7 v s h d n h u ' , 2 ) 6 6 3 ' 0 2 % & . ' , 2 9 ' ' ' e d w w h u \ 9 ' ' ' ? + 9 % $ 7 , 1 % ? ) & 9 % $ 7 / % 6 7 5 ) 9 % $ 7 ? ) & ) 9 % $ 7 ? ) & 9 ' ' ' TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 18 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection fig 7. typical stereo application o & o 6 6 ' $ & 7 5 / $ 8 ' , 2 , 1 $ ( & 6 & / ' , 2 ) 6 % & . ' , 2 5 6 7 , 1 7 % $ 6 ( % $ 1 ' 3 5 2 & ( 6 6 2 5 7 ) $ 6 ' $ 6 & / ' , 2 ) 6 % & . ' , 2 5 6 7 , 1 7 7 ) $ ' , 2 d d d ) 6 % & . ' , 2 9 ' ' ' 9 ' ' ' e d w w h u \ 9 ' ' ' ? + 9 % $ 7 , 1 % ? ) & 9 % $ 7 / % 6 7 5 ) 9 % $ 7 ? ) & ) 9 % $ 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 * 1 ' ' * 1 ' 3 * 1 ' % $ ' 6 $ ' 6 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 * 1 ' ' * 1 ' 3 * 1 ' % $ ' 6 $ ' 6 7 ( 6 7 2 8 7 $ 2 8 7 % & 9 ' ' 3 [ ? ) & ( 0 & q ) 9 ' ' 3 9 % 6 7 v s h d n h u 2 8 7 $ 2 8 7 % ? ) & 9 ' ' ' & 9 ' ' 3 [ ? ) & ( 0 & q ) 9 ' ' 3 9 % 6 7 v s h d n h u ' , 2 ) 6 % & . ' , 2 9 ' ' ' e d w w h u \ 9 ' ' ' ? + 9 % $ 7 , 1 % ? ) & 9 % $ 7 / % 6 7 5 ) 9 % $ 7 ? ) & ) 9 % $ 7 ? ) & 9 ' ' ' 6 3 ' 0 2 6 3 ' 0 2 TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 19 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection fig 8. stereo application using single coil o & o 6 6 ' $ & 7 5 / $ 8 ' , 2 , 1 $ ( & 6 & / ' , 2 ) 6 % & . ' , 2 5 6 7 , 1 7 % $ 6 ( % $ 1 ' 3 5 2 & ( 6 6 2 5 7 ) $ 6 ' $ 6 & / ' , 2 ) 6 % & . ' , 2 5 6 7 , 1 7 7 ) $ ' , 2 d d d ) 6 % & . ' , 2 9 ' ' ' 9 ' ' ' e d w w h u \ 9 ' ' ' 9 % $ 7 , 1 % 5 ) 9 % $ 7 5 + 9 % $ 7 0 ? ) & ) 9 % $ 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 * 1 ' ' * 1 ' 3 * 1 ' % $ ' 6 $ ' 6 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 * 1 ' ' * 1 ' 3 * 1 ' % $ ' 6 $ ' 6 7 ( 6 7 2 8 7 $ 2 8 7 % & 9 ' ' 3 [ ? ) & ( 0 & q ) 9 ' ' 3 9 % 6 7 v s h d n h u 2 8 7 $ 2 8 7 % ? ) & 9 ' ' ' & 9 ' ' 3 [ ? ) 9 ' ' 3 9 % 6 7 v s h d n h u ' , 2 6 3 ' 0 2 6 3 ' 0 2 ) 6 % & . ' , 2 9 ' ' ' e d w w h u \ 9 ' ' ' ? + 9 % $ 7 , 1 % ? ) & 9 % $ 7 / % 6 7 5 ) 9 % $ 7 ? ) & ) 9 % $ 7 ? ) & 9 ' ' ' TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 20 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 13. package outline fig 9. package outline TFA9892auk/n1 (wlcsp49) 5 h i h u h q f h v 2 x w o l q h y h u v l r q ( x u r s h d q s u r m h f w l r q , v v x h g d w h , ( & - ( ' ( & - ( , 7 $ v r w b s r ; h h h h e $ & % ? y & ? z & \ % ' ( $ 6 2 7 : / & 6 3 z d i h u o h y h o f k l s v f d o h s d f n d j h e x p s v [ [ p p v f d o h p p 6 2 7 ' ( ) * $ % & = ( = ( = ' = ' $ $ $ g h w d l o ; 8 q l w p p p d [ q r p p l q $ ' l p h q v l r q v p p d u h w k h r u l j l q d o g l p h q v l r q v $ $ e ' ( \ h h h y z = ( = ' = ' = ( e d o o $ l q g h [ d u h d e d o o $ l q g h [ d u h d TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 21 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 14. soldering of wlcsp packages 14.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. all nxp wlcsp packages are lead-free. 14.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 14.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 10 ) than a snpb process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 1 0 . moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 10 . table 10. lead-free process (from j-std-020d) package thickness (mm) package reflow temperature ( ? c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 22 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 14.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 14.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 14.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. msl: moisture sensitivity level fig 10. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 23 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 14.3.4 cleaning cleaning can be done after reflow soldering. TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 24 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 15. revision history table 11. revision history document id release date data sheet status change notice supersedes TFA9892_sds v.1 20170901 product short data sheet - - draft draft draft dr draft draft draft draf draft draft dra f t d raft draft d dra f t draft draft draft draft d raft d ra TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 25 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification. draft draft draft dr draft draft draft draf draft draft dra f t d raft draft d dra f t draft draft draft draft d raft d ra TFA9892_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2017. all rights reserved. product short data sheet rev. 1.0 ? 1 september 2017 26 of 27 nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. coolflux ? is a trademark of nxp b.v. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com draft draft draft dr draft draft draft draf draft draft dra f t d raft draft d dra f t draft draft draft draft d raft d ra nxp semiconductors TFA9892 12 v boosted audio system with adaptive sound maximizer and speaker protection ? nxp b.v. 2017. all rights reserved. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 1 september 2017 document identifier: TFA9892_sds please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 3 5 ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 5 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 functional description . . . . . . . . . . . . . . . . . . . 9 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 10 thermal characteristics . . . . . . . . . . . . . . . . . 11 11 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 11.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . 12 11.2 ac characteristics. . . . . . . . . . . . . . . . . . . . . . 13 11.3 tdm/i 2 s timing characteristics . . . . . . . . . . . . 15 11.4 i 2 c timing characteristics . . . . . . . . . . . . . . . . 16 12 application information. . . . . . . . . . . . . . . . . . 17 12.1 application diagrams . . . . . . . . . . . . . . . . . . . 17 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 14 soldering of wlcsp packages. . . . . . . . . . . . 21 14.1 introduction to soldering wlcsp packages . . 21 14.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . 21 14.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21 14.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 14.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . 22 14.3.3 rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 14.3.4 cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 25 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26 17 contact information. . . . . . . . . . . . . . . . . . . . . 26 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 |
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